Semiconductor components are made from materials with defined band gap depending on material properties. Silicon, silicon carbide (SiC), germanium, and gallium arsenide (GaAs), and Gallium nitride (GaN) are some of the example of semiconductor materials. Property of these semiconductor material is exploit by the semiconductor components or packaged devices. These are used in components are highly doped to control precisely the position and concentration of p- and n-type substrate. Some of the semiconductor components (passive) are diode, inductors, capacitors, and resistors. To manufacture compact passive semiconductor components, integrated passive device technology could be used. The technology is a highly effective that integrate various passive semiconductor components into a same die made up of silicon or other semiconductor materials. There is an increasing demand for semiconductor components with multi-function features; for instance, industry and market trends show a great convergence of advanced packaging solutions in hand-held products such as smartphones, tablets, portable media players, and others.
Semiconductor components manufactured from Silicon carbide (SiC) and Gallium Nitride material gained high traction due various emerging applications in telecommunication, energy & power, and automation products such as motor drives. Motor drives components uses SiC material-based metal oxide semiconductor field-effect transistor (MOSFET). These type of MOSFET has less turn off time, hence power losses could be reduced. Moreover, with regards to the efficiency of SiC-material based components, the combination of lower switching and conduction losses in SiC components reduces system failure and increases motor drive efficiency. All these features of SiC material based components have led to the increase in the growth rate of semiconductor material and component market.
Semiconductor material- Silicon, GaN, and SiC has revolutionized various applications such as; automation, energy & power, consumer devices, etc. With ever-increasing adoption of technology in each and every sector, market for these materials and components is expected to increase multiple folds in near future. SiC offers a wide bandgap, large critical electric field, and high thermal conductivity that permit SiC material based components to work at higher temperatures and higher current density. Currently, SiC material based components are used in turbine engine combustion monitoring, temperature sensors, analog and digital circuitry, flame detectors, accelerometers, RF devices, and electronic components used in harsh environment. SiC material based components have distinct features to work above 400°C without any external cooling. This feature can greatly benefit a variety of applications and industries such as aerospace, defense, automotive and power generation industry. In addition, SiC material based semiconductor components can sustain 10 times higher voltage than the other semiconductor material-based components. Therefore, these properties can reduce cooling costs and complexity.